product details dimension a dimension b dimension c dimension d interface material finish notes: d imension c = heat sink height from bottom of the base to the top of the fn feld. thermal performance data are provided for reference only. actual performance may vary by application. ats reserves the right to update or change its products without notice to improve the design or performance. contact ats to learn about custom options available. 1) 2) 3) 4) t hermal performance for more information, to fnd a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (north america); +31 (0) 3569 84715 (europe). ats part # ATS-54325K-C2-R0 features & benefts high performance bga cooling solutions w/ thermal tape attachment rev1_0908 air velocity thermal r esistance ft/min m/s c/w (unducted flow) c/w (ducted flow) 200 1.0 300 1.5 400 2.0 500 2.5 600 3.0 700 3.5 800 4.0 5.9 4.4 3.7 3.3 3 2.8 2.6 3.2 32.5 mm 32.5 mm 14.5 mm 32.5 mm black-anodized saint -gobain c675 high aspect ratio, straight fin heat sinks that are ideal for compact pcb environments designed specifically for bgas and other surface mount packages comes preassembled with high performance thermal interface material ? ? ? c a b d *image above is for illustration purposes only.
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